Speed of Light, the Vanished Points of Reference
Issue:
Volume 3, Issue 2, April 2014
Pages:
12-14
Received:
30 April 2014
Accepted:
5 June 2014
Published:
20 June 2014
Abstract: At the suggestion of H.A. Lorentz, Michelson’s famous experiment of 1881 was repeated in 1887 because of an alleged error pointed out by Potier. By overlooking a minor omission when compounding the newer data, the suggested correction did not materially change the original conclusion, namely, that light was propagated with constant speed (c) irrespective of the motion of its source or observer, contrary to classical Galilean principles. Though universally accepted, careful analysis reveals that, aside from the computational error, old forgotten actual astronomical data militate against this interpretation. Bypassing the limiting constant (c) may therefore open the road to advances in optics.
Abstract: At the suggestion of H.A. Lorentz, Michelson’s famous experiment of 1881 was repeated in 1887 because of an alleged error pointed out by Potier. By overlooking a minor omission when compounding the newer data, the suggested correction did not materially change the original conclusion, namely, that light was propagated with constant speed (c) irresp...
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AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface
Masoud Delgosha,
Samira Salehi,
Leila Unesi borujeni,
Soheil Sharifi
Issue:
Volume 3, Issue 2, April 2014
Pages:
15-18
Received:
1 July 2014
Accepted:
15 July 2014
Published:
20 July 2014
Abstract: The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.
Abstract: The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force...
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